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Possessing a small chip size, the Wafer-Level Chip Scale Package (WLCSP) solution is one of the most cost-effective and space-efficient packaging options in the industry.

Macronix WLCSP is a true chip-scale package, offering an extremely small footprint. The key advantages include:

  • Low chip-to-PCB inductance
  • Reduced package size
  • Enhanced thermal conduction

WLCSP is the ideal solution for mobile or portable form factor applications, such as mobile phones, tablets, digital cameras, smart watches, bluetooth headsets, and GPS navigation devices.


Macronix WLCSP Solutions

Please contact your local Macronix sales person for the most suitable solutions that meet your needs.

Related Solution


Known Good Die

Macronix provides KGD products for custom System in Package (SiP) solutions requiring small form factor Flash memory. Our KGD products are ideal for diverse applications, such as portable consumer electronics, set-top box, DSC, mobile phones, IoT/wearable devices, automotive devices, GPS, tablets, industrial, networking.


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